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PDF HBNPZ1NS6R Fiche technique - CYStech Electronics

Numéro de référence HBNPZ1NS6R
Description General Purpose NPN PNP Epitaxial Planar Transistors(dual transistors)
Fabricant CYStech Electronics 
Logo CYStech Electronics Logo 

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HBNPZ1NS6R Datasheet, Description
CYStech Electronics Corp.
Spec. No. : C901S6R
Issued Date : 2009.06.05
Revised Date : 2011.02.22
Page No. : 1/6
General Purpose NPN / PNP Epitaxial Planar Transistors
(dual transistors)
HBNPZ1NS6R
Features
Mounting possible with SOT-323 automatic mounting machines.
Transistor elements are independent, eliminating interference.
Mounting cost and area can be cut in half.
Pb-free package.
Equivalent Circuit
HBNPZ1NS6R
Outline
SOT-363R
EIAJ:SC-88/SC-70-6 JEDEC: SOT-363
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Power Dissipation
Junction Temperature
Storage Temperature
Symbol
VCBO
VCEO
VEBO
IC
Pd
Tj
Tstg
Limits
TR1 (NPN)
TR2 (PNP)
50 -50
45 -45
6 -5
150 -150
200(total) *1
150
-55~+150
Note: *1 150mW per element must not be exceeded.
Unit
V
V
V
mA
mW
°C
°C
HBNPZ1NS6R
CYStek Product Specification
http://www.Datasheet4U.com
HBNPZ1NS6R Fiche technique
CYStech Electronics Corp.
Characteristic curves
TR1 (NPN)
Spec. No. : C901S6R
Issued Date : 2009.06.05
Revised Date : 2011.02.22
Page No. : 3/6
Current Gain vs Collector Current
Saturation Voltage vs Collector Current
1000
HFE@VCE=6V
1000
VCE(SAT)@IC=10IB
100
100
0.1
1 10 100
Collector Current--- IC(mA)
1000
Saturation Voltage vs Collector Current
1000
VBE(SAT)@IC=10IB
10
0.1
1 10 100
Collector Current--- IC(mA)
1000
Cutoff Frequency vs Collector Current
1
FT@VCE=12V
100
0.1
1 10 100
Collector Current ---IC (mA)
1000
0.1
1
10
Collector Current---IC (mA)
100
HBNPZ1NS6R
CYStek Product Specification

3 Page

HBNPZ1NS6R pdf
CYStech Electronics Corp.
SOT-363 Dimension
Marking:
Spec. No. : C901S6R
Issued Date : 2009.06.05
Revised Date : 2011.02.22
Page No. : 6/6
BF
Device
Code
6-Lead SOT-363R Plastic
Surface Mounted Package
CYStek Package Code: S6R
Style:
Pin 1. Emitter1 (E1)
Pin 2. Base1 (B1)
Pin 3. Collector2 (C2)
Pin 4. Emitter2 (E2)
Pin 5. Base2 (B2)
Pin 6. Collector1 (C1)
DIM
Millimeters
Min. Max.
Inches
Min. Max.
DIM
Millimeters
Min. Max.
Inches
Min. Max.
A 0.900 1.100 0.035 0.043 E1 2.150 2.450 0.085 0.096
A1 0.000 0.100 0.000 0.004
e
0.650 TYP
0.026 TYP
A2 0.900 1.000 0.035 0.039 e1 1.200 1.400 0.047 0.055
b 0.150 0.350 0.006 0.014 L
0.525 REF
0.021 REF
c 0.080 0.150 0.003 0.006 L1 0.260 0.460 0.010 0.018
D 2.000 2.200 0.079 0.087 θ
0°
8°
0°
8°
E 1.150 1.350 0.045 0.053
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
Lead : Pure tin plated.
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
HBNPZ1NS6R
CYStek Product Specification

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