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Numéro de référence HBN3101S6R
Description NPN Epitaxial Planar Transistor
Fabricant CYStech Electronics 
Logo CYStech Electronics Logo 

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HBN3101S6R Datasheet, Description
CYStech Electronics Corp.
NPN Epitaxial Planar Transistor
HBN3101S6R
(Dual Transistors)
Spec. No. : C234S6R
Issued Date : 2013.10.21
Revised Date :
Page No. : 1/6
Features
Two BF422 chips in a SOT-363 package.
Mounting possible with SOT-323 automatic mounting machines.
Transistor elements are independent, eliminating interference.
Mounting cost and area can be cut in half.
High BVCEO, BVCEO300V
Pb-free lead plating and halogen-free package.
Equivalent Circuit
HBN3101S6R
Outline
SOT-363
Tr1 Tr2
Ordering Information
Device
HBN3101S6R-0-T1-G
Package
SOT-363
(Pb-free lead plating and halogen-free package)
Shipping
3000 pcs / tape & reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T1 : 3000 pcs / tape & reel, 7” reel
Product rank, zero for no rank products
Product name
HBN3101S6R
CYStek Product Specification
http://www.Datasheet4U.com
HBN3101S6R Fiche technique
CYStech Electronics Corp.
Spec. No. : C234S6R
Issued Date : 2013.10.21
Revised Date :
Page No. : 3/6
Typical Characteristics
Current Gain vs Collector Current
1000
10000
Saturation Voltage vs Collector Current
100 VCE = 20V
VCE = 10V
VCE = 5V
10
1
10
Collector Current---IC (mA)
100
Saturation Voltage vs Collector Current
1000
VBE(SAT) @ IC =10IB
100
1
10
Collector Current---IC (mA)
100
Recommended Soldering Footprint
1000
VCE(SAT) @ IC = 20IB
100
10
1
VCE(SAT) @ IC = 10IB
10
Collector Current---IC (mA)
250
200
150
100
50
0
0
Power Derating Curves
Dual
Single
50 100 150
Ambient Temperature---TA(℃)
100
200
HBN3101S6R
CYStek Product Specification

3 Page

HBN3101S6R pdf
CYStech Electronics Corp.
SOT-363 Dimension
Spec. No. : C234S6R
Issued Date : 2013.10.21
Revised Date :
Page No. : 6/6
Marking:
K4N
Device
Code
Date Code:
Year + Month
Year : 62006,
72007,…, etc
Month : 1Jan
2Feb, …, 9
Sep, AOct, B
Nov, CDec
6-Lead SOT-363 Plastic
Surface Mounted Package
CYStek Package Code: S6R
Style:
Pin 1. Emitter1 (E1)
Pin 2. Base1 (B1)
Pin 3. Collector2 (C2)
Pin 4. Emitter2 (E2)
Pin 5. Base2 (B2)
Pin 6. Collector1 (C1)
DIM
Millimeters
Min. Max.
Inches
Min. Max.
DIM
Millimeters
Min. Max.
Inches
Min. Max.
A 0.900 1.100 0.035 0.043 E1 2.150 2.450 0.085 0.096
A1 0.000 0.100 0.000 0.004
e
0.650 TYP
0.026 TYP
A2 0.900 1.000 0.035 0.039 e1 1.200 1.400 0.047 0.055
b 0.150 0.350 0.006 0.014 L
0.525 REF
0.021 REF
c 0.080 0.150 0.003 0.006 L1 0.260 0.460 0.010 0.018
D 2.000 2.200 0.079 0.087
θ
0°
8°
0°
8°
E 1.150 1.350 0.045 0.053
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
Lead : Pure tin plated.
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
HBN3101S6R
CYStek Product Specification

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